Manufacturing and Technology - Electronic Components
Manufacturing using the new method "thick film printing method" that embodies joining through high melting points.
The LID of package-type oscillators. Traditionally, the manufacturing method in this field has involved the assembly of Kovar and press-cut Au/Sn solder materials. We propose a new manufacturing method, "thick film printing method," which allows us to offer lower prices. The LID manufacturing in this field using the "thick film printing method" is a technique developed by our company. For more details, please contact us or download the catalog.
- Company：ソーデナガノ
- Price：Other
